Multi-protocol Wireless Module - RF-BM-2652P2
Operating Voltage: 1.8 ~ 3.8 V, recommended 3.3V
Operating Frequency: 2402 MHz ~ 2480 MHz
Maximum Transmit Power: +20 dBm
Receiver Sensitivity:
-100 dBm @ 802.15.4 (2.4 GHz)
-105 dBm @ Bluetooth 125-kbps (LE Coded PHY)
SRAM： 80 KB
FLASH： 352 KB
GPIO Count: 23
Crystal Frequency: 48 MHz, 32.768 kHz
Package Type: SMT package (stamp half-hole)
Communication Interfaces: UART, I2S, I2C, SPI, ADC
Module Dimensions: 30 x 16.4 mm
Operating Temperature: -40°C ~ +85°C
Product Introduction
RF-BM-2652P2It is based on Texas InstrumentsCC2652P as the core, an independently developed SimpleLink multi-protocol 2.4GHz high transmit power (+20dBm) wireless module.
In addition to integrating a high-performanceARMCortex-M4F processor for application logic and a dedicated ARM Cortex-M0 processor for the RF core, the module also features a unique 16-bit low-power sensor processing core. It has 352KB programmable flash memory and 80KB ultra-low leakage RAM (SRAM). It supports wireless communication protocols such as Thread, ZigBee, Bluetooth Low Energy 5.0, 6LoWPAN, Wi-SUN, etc.
The module has all pinsI/Obrought out, and complies withFCC、CE、RoHSrelevant specifications for RF and electromagnetic compatibility, meetingexport requirements. The module integrates an industrial-grade 48MHz crystal oscillator and a 32.768kHz low-power clock crystal. It includes various peripherals such as I2C, I2S, UART, SPI, ADC, and GPIO.
Operating Voltage: 1.8 ~ 3.8 V, recommended 3.3V
Operating Frequency: 2402 MHz ~ 2480 MHz
Maximum Transmit Power: +20 dBm
Receiver Sensitivity:
-100 dBm @ 802.15.4 (2.4 GHz)
-105 dBm @ Bluetooth 125-kbps (LE Coded PHY)
SRAM： 80 KB
FLASH： 352 KB
GPIO Count: 23
Crystal Frequency: 48 MHz, 32.768 kHz
Package Type: SMT package (stamp half-hole)
Communication Interfaces: UART, I2S, I2C, SPI, ADC
Module Dimensions: 30 x 16.4 mm
Operating Temperature: -40°C ~ +85°C
II. Multi-protocol Wireless Module -Applications of RF-BM-2652P2:
