The MS2374 series devices are quad complementary output line drivers that meet the requirements of ANSI TIA/EIA-422-B and ITU (formerly CCITT) Recommendation V.11.
The MS2576/MS2576T is a low-power quad differential line driver chip for balanced or unbalanced digital data transmission.
The MS2575/MS2575T is a low-power quad differential line receiver chip for balanced or unbalanced digital data transmission.
The MS3585 is a half-duplex, adaptive bus polarity, ±20kV ESD transceiver chip for RS-485 communication systems, with transmission and reception rates up to 10Mbps.
The MS3485/MS3485M/MS3485D is a half-duplex, ±20kV ESD transceiver chip for RS-485 communication systems, with transmission and reception rates up to 10Mbps.
The MS2591 is a low-power, high-ESD RS485 communication interface circuit; in receive mode, its power consumption is only about 365uA, and in shutdown mode, it does not exceed 1uA.
The MS2583/MS2583M is a low-power, 5Mbps, high-ESD RS422 communication interface circuit; in receive mode, its power consumption is only about 0.3mA; A/B terminal ESD withstand voltage is up to ±15kV.
The MS2581/MS2581M is a low-power, high-ESD RS422 communication interface circuit; in receive mode, its power consumption is only about 120uA; A/B terminal ESD withstand voltage is up to ±15kV.
The MS2561 is a low-power, high-ESD RS485 communication interface circuit; in receive mode, its power consumption is only about 120uA, and in shutdown mode, it does not exceed 1uA.
The MS2375 series chips are quad differential line receivers suitable for balanced or unbalanced digital signal transmission systems.
The MS1585/MS1585M/MS1585D is a half-duplex, adaptive bus polarity, ±20kV ESD transceiver chip for RS-485 communication systems, with transmission and reception rates up to 10Mbps.
The MS1285/MS1285M/MS1285D is a half-duplex, ±20kV ESD transceiver chip for RS-485 communication systems, with transmission and reception rates up to 10Mbps.
The MS913/MS914 chipset is a 25MHz~100MHz 10-bit/12-bit FPD-Link III SER/DES (Serializer/Deserializer) that provides a high-speed FPD-Link III interface and high-speed forward channel as well as a bidirectional control channel for data transmission over differential pairs.
The MS1023 serializer and MS1224 deserializer are a pair of 10-bit parallel-to-serial/serial-to-parallel conversion chips used for transmitting and receiving serial data at parallel word rates of 10MHz to 80MHz over LVDS differential backplanes.
The MS2201 is a Gigabit Ethernet transceiver circuit that enables ultra-high-speed full-duplex data transmission.
The MS9218 digital video serial/parallel converter deserializes a total of 27 bits of data during data and control cycles.
The MS721 is a monolithic transceiver circuit developed for applications of the M-Bus standard (EN1434-3).
The MS726 is a monolithic transceiver circuit developed for applications of the M-Bus standard (EN1434-3).
The CT8225 touch detection IC is a touch chip designed using the capacitive sensing principle.
Capacitive Touch Chip - GTX315L is one of the GreenTouch 3LP™ capacitive touch product sensor series.
GT304L is one of the GreenTouch3™ series capacitive touch sensors. In particular, GT304L can perform capacitive sensing with 4 channels running on the GreenTouch3™ engine.
GT308L is one of the GreenTouch3™ capacitive touch product sensor series. In particular, GT308L can perform capacitive sensing with 8 channels running on the GreenTouch3™ engine.
GT301L is one of the GreenTouch3™ capacitive touch sensor series. In particular, GT301L can perform capacitive sensing with the GreenTouch3™ engine operation. The GreenTouch3™ engine is an environmental compensation circuit.
GTX301L is one of the GreenTouch 3LP™ capacitive touch product sensor series. In particular, GTX301L can perform capacitive detection with 1 channel running on the GreenTouch 3LP™ engine.
GT316L is one of the GreenTouch3™ capacitive touch product sensor series. In particular, GT316L can perform capacitive sensing with 16 channels running on the GreenTouch3™ engine.
GTC08L is a new GreenTouch5C™ capacitive touch sensor series; packaged in SOP-16L; suitable for a voltage range of 2.7V to 5.5V.
CT8224C is a touch IC designed using the capacitive sensing principle. This IC has a built-in voltage regulator circuit for the touch sensor.
GTX314L is one of the GreenTouch 3LP™ capacitive touch product sensor series. In particular, GTX314L can perform capacitive detection with 14 channels running on the GreenTouch 3LP™ engine.
GTX312L is one of the GreenTouch 3LP™ capacitive touch product sensor series. In particular, GTX312L can perform capacitive sensing with 12 channels running on the GreenTouch 3LP™ engine.
AME200 is a new generation magnetic encoder chip developed by Zhongke Alpha based on advanced AMR technology and a high-performance, dedicated ASIC signal processor.
AM100 is an angle sensor IC based on Anisotropic Magnetoresistance (AMR) technology.
The differential liquid level module LDM (Liquid-level-Differential-Mini) uses the differential capacitive measurement principle, measuring changes in dielectric constant through a capacitive sensing chip. The module outputs capacitance values as digital signals, which are converted into liquid level height, etc.
The single-ended liquid level module LSP (Liquid-level-Single-ended-Pro) uses the single-ended-to-ground capacitive measurement principle, measuring changes in dielectric constant through a capacitive sensing chip. The module outputs capacitance values as digital signals, which are converted into liquid level height, etc.
The liquid level sensing module LLM (Liquid-level Meter) measures changes in dielectric constant through a capacitive high-frequency circuit, and the module outputs liquid capacitance values as digital signals.
WS11 (Water Sensor-MC11S) is a capacitive, non-contact sensing smart water immersion module.
The cascadable multi-point inclinometer RTS (Rock Tilt Sensor) can be networked in multi-point series based on the RS485 bus.
The conductivity, level, and temperature composite sensor ECLT (Electrical Conductivity, Level and Temperature sensor) is based on the high-frequency differential capacitive sensing SoC chip MCP61 combined with embedded algorithms.
The water flow bubble detector MWFD (Minyuan Water Flow Detector) measures changes in the dielectric constant of the liquid inside the pipe through a high-frequency capacitive detection chip: different capacitance values reflect whether the pipe contains air or liquid. When air is detected, it outputs a high level for alarm.
The wading sensor WWS (Wading Water Sensor) is a capacitive, non-contact sensing smart sensor.
WS61 (Water Sensor) is a capacitive, non-contact sensing smart water immersion sensor.
The water immersion sensor WLD (Water Leak Detector) is a capacitive, non-contact sensing smart water immersion sensor.
The deep water level sensor DLM1 (Deep Liquid-level Meter) is a liquid level sensor that senses continuous liquid level changes through capacitive high-frequency dielectric constant measurement.
The electronic water gauge level sensor MER-MCP1081-260-26 is based on the capacitive non-contact measurement principle, with the sensing main chip being the ten-channel multi-mode wideband digital capacitive processor chip MCP1081S.
MC11S and MC11T are highly integrated dual-channel capacitive sensing chips.
MC12G and MC12T are highly integrated dual-channel capacitive sensing chips.
The MCP62 series (Mysentech Capacitive Processor) is a new generation capacitive sensing microprocessor SoC chip launched by Mysentech Sensing.
The MCP61 series (Mysentech Capacitive Processor) is a new generation capacitive sensing microprocessor SoC chip launched by Mysentech Sensing.
The MC1081 series is a highly integrated, multi-channel, wideband digital capacitive sensing chip.
MLC12G is a highly integrated dual-channel inductive capacitive sensing chip.
MCP1081S (Mysentech Capacitive Processor) is a new generation capacitive sensing microprocessor SoC chip launched by Mysentech Sensing.
The icing sensor MDC-ICE is specifically designed for detecting ice on wind turbine blades. It can monitor the blade icing status in real time through changes in the dielectric constants of ice, water, and air.
The capacitive liquid level switch sensing module LLS-MCP61 (Liquid-level Switch-MCP61) measures changes in dielectric constant through a dedicated capacitive high-frequency sensing chip.
The capacitive overflow sensing module WK-MCP1081 (Water Kettle Boiling Sensor) measures foam generated by liquid inside non-metallic containers through the wideband capacitive detection chip MCP1081.
The frost electrode pad ICEFPC is a smart sensor based on capacitive sensing, integrating Mysentech's high-precision differential capacitive sensing chip MDC04.
The capacitive multi-point liquid level sensing module (MER-MCP1081-50-30) is based on Mysentech's independently developed ten-channel multi-mode wideband digital capacitive processor chip MCP1081S.
The Bluetooth temperature and vibration module MTV4.0 is based on wireless Bluetooth BLE5.1 communication, using Mysentech's independently developed high-precision programmable digital temperature series chips (T117B, etc.).
The capacitive liquid level temperature sensor MOLT (Minyuan Oil Level & Temperature) uses dedicated capacitive sensing chips MDC04 or MCP61.
The thermal wind speed sensor TWS (Thermal Wind Sensor) is a digital smart wind speed sensor.
